Figure 3 a is a HAADF image of the …. The results show that the addition of Bi can refine the microstructure of Mg-3Al-3Nd alloy. 至于SnBi与SnBiAg的差异，就出在Ag（银）的身上，一般来说锡膏中加入银是为了改善润湿性、加强焊点强度与提抗疲劳性，有利产品通过冷热循环测试，但含银量如果太多反而会增加脆性，所以目前很多广州SMT贴片加工厂普遍使用的 . When the reflow temperature is below 220 °C, the joints reflowed for 150 min often fail in brittle mode because the Bi atoms from the SnBi solder easily segregated at the Cu 3 Sn/Cu interface. 2020 · Bentley’s AssetWise solution provides an out-of-the-box commercial off-the-shelf (COTS) solution pre-configured with everything you need to perform NBI data collection, including web and mobile . In contrast, Bi …  · Intent NBI implementations make use of continuous-loop comparison among: existing and new Intent requests, mappings, and controlled-resource sets and states; to … 2016 · In this study, Ni functionalized Sn58Bi solder alloys were successfully synthesized. 2020 · 除了具有/不具有放大功能的窄带成像（NBI）之外，还使用了各种类型的电子染色体内窥镜检查，包括自发荧光成像，I-SCAN和柔性光谱成像色彩增强。 这些技术使 … 2021 · Low reflow temperature solder interconnect technology based on Sn-Bi alloys is currently being considered as an alternative for Sn-Ag-Cu solder alloys to form solder interconnects at significantly lower melting temperatures than required for Sn-Ag-Cu alloys. When the content (mass fraction) of Bi is … 2008 · Bi in Sn solder alloy not only promotes the reaction of Cu 6 Sn 5 + Sn → Cu 3 Sn at the initial stage, but also induces interfacial voids at the Cu 3 Sn/Cu interface during thermal aging as shown in Figure 2 a and b. 2019 · The effect of Bi on the microstructure and mechanical properties of Mg-3Al-3Nd alloy was investigated by scanning electron microscope (SEM), optical microscope (OM), X-ray diffraction (XRD) and tensile test....

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